Highly conductive ZnO grown by pulsed laser deposition in pure Ar Robin C. Scott, Kevin D. Leedy, Burhan Bayraktaroglu, David C. Look, and Yong-Hang Zhang Citation: Applied Physics Letters 97, 072113 (2010); doi: 10.1063/1.3481372 View online: http://dx.doi.org/10.1063/1.3481372 View Table of Contents: http://scitation.aip.org/content/aip/journal/apl/97/7?ver=pdfcov Published by the AIP Publishing Articles you may be interested in Stable highly conductive ZnO via reduction of Zn vacancies Appl. Phys. Lett. 101, 102101 (2012); 10.1063/1.4748869 Optical and electrical properties of transparent conducting B-doped ZnO thin films prepared by various deposition methodsa) J. Vac. Sci. Technol. A 29, 041504 (2011); 10.1116/1.3591348 Ga-doped ZnO grown by pulsed laser deposition in H 2 : The roles of Ga and H J. Vac. Sci. Technol. A 29, 03A102 (2011); 10.1116/1.3523296 Effects of ZnO buffer layers on the fabrication of GaN films using pulsed laser deposition J. Appl. 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Look,3,a兲 and Yong-Hang Zhang4 1 School of Mechanical, Aerospace, Chemical and Materials Engineering, Arizona State University, Tempe, Arizona 85287, USA 2 Air Force Research Laboratory, Wright-Patterson AFB, Ohio 45433, USA 3 Semiconductor Research Center, Wright State University, Dayton, Ohio 45435, USA 4 School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, Arizona 85287, USA 共Received 21 July 2010; accepted 29 July 2010; published online 19 August 2010兲 Ga-doped ZnO was deposited by pulsed laser deposition at 200 ° C on SiO2 / Si, Al2O3, or quartz in 10 mTorr of pure Ar. The as-grown, bulk resistivity at 300 K is 1.8⫻ 10−4 ⍀ cm, three-times lower than that of films deposited at 200 ° C in 10 mTorr of O2 followed by an anneal at 400 ° C in forming gas. Furthermore, depth uniformity of the electrical properties is much improved. Mobility analysis shows that this excellent resistivity is mostly due to an increase in donor concentration, rather than a decrease in acceptor concentration. Optical transmittance is approximately 90% in the visible and near-IR spectral regions. © 2010 American Institute of Physics. 关doi:10.1063/1.3481372兴 Forming-gas 共FG兲 共5% H2 in Ar兲 annealing of ZnO films doped with donor impurities such as Al, Ga, or In, has been shown to increase conductivity1,2 and is often used in preparing transparent conductive oxides 共TCOs兲. The improved conductivity has often been attributed to the ability of H to directly provide donors and also to passivate negatively charged acceptors, including those causing potential barriers in grain boundaries.3,4 However, as shown recently, the bulk electrical properties after FG anneals are not uniform with depth, as evidenced by the thickness dependences of resistivity ␳, mobility ␮, and carrier concentration n.5,6 Furthermore, H is known to be quite mobile, potentially impacting the reliability of certain devices.7 Thus, it is preferable to obtain the desired high film conductivity without the assistance of H. Ga-doped ZnO films are often grown using pulsed laser deposition 共PLD兲, and generally in an oxygen-rich environment, presumably to ensure stoichiometric films. However, as the partial pressure of oxygen is increased, the film resistivity increases and electron mobility decreases.8,9 This high resistivity resulting from excess oxygen is likely related to 共1兲 an increase in compensating point-defect-related acceptors, such as the Zn vacancy VZn and 共2兲 diffusion of O2 共forming O2−兲 into grain boundaries 共GBs兲 and other macroscopic defects. The O2 centers at GBs capture electrons that can induce high potential barriers; these barriers can further impede transport by reducing mobility. In the present work, Ga-doped ZnO was deposited at 200 ° C in Ar instead of O2. There are reasons to believe that growth in Ar might enhance conductivity by inhibiting the formation of VZn acceptors in the bulk and O2 acceptors at grain boundaries. The Ga-doped ZnO films were deposited using a Neocera Pulsed Energy deposition tool. The target, consisting a ZnO ceramic sintered with 3 wt % Ga2O3, was ablated with a 248 nm KrF pulsed laser operating at a frequency of 30 Hz. The energy density at the target surface was 2.6 J / cm2. During deposition, the target was rotated at a兲 Electronic mail: david.look@wright.edu. 40 deg/s and rastered by + / −2 deg to prevent preferential ablation at the center of the target, and the susceptor was rotated at 20 deg/s The target to wafer distance was fixed at 9.5 cm. The substrate was heated by means of a coiled resistive element located approximately 3 mm from the substrate wafer. The pressure was controlled for both O2 and Ar processes by flowing the appropriate volume of gas and setting the turbo pump to 250 Hz. The number of laser pulses was chosen to achieve film thicknesses of 30 to 300 nm. To determine donor ND and acceptor NA concentrations, temperature-dependent Hall-effect measurements were carried out over a range of 15–320 K using a Lakeshore 7507 apparatus. The values of n were independent of temperature, and those of ␮ and ␳, only slightly dependent. It is instructive to compare n for a sample grown in Ar 共called the “Ar layer”兲 with that of one grown in O2 共the “O2 layer”兲. Since the O2 layer had earlier been grown on SiO2 / Si, the Ar layer was also grown on this material; however, up to this point we have noticed no great dependence of n on choice of substrate. The Ar-layer thickness was 82 nm, as measured by spectroscopic ellipsometry 共SE兲, and the O2-layer, 99 nm. In the as-grown O2 layer, n was low, about 6 ⫻ 1019 cm−3. As mentioned earlier, such a low value of n is probably due to high concentrations of VZn–related acceptors in the bulk and O2-related acceptors at the GBs. However, when the O2 layer was annealed in FG at 400 ° C for 10 min, n increased greatly, up to about 4.3⫻ 1020 cm−3. This increase is likely due to the H-induced reduction of O2 from the GBs and the H passivation of VZn, i.e., VZn + 2H → VZn − 2H. On the other hand, the Ar layer has a high value of n, as deposited, about 8.1⫻ 1020 cm−3. Upon annealing in FG, n actually decreases slightly, while the mobility ␮ increases slightly, a scenario that can be explained only by a decrease in the donor concentration ND. This observation is not in line with conventional wisdom which would have predicted an increase in ND, due to the addition of H donors, and a decrease in NA, due to the passivation of acceptors. Thus, the role of H is unclear in this case. 0003-6951/2010/97共7兲/072113/3/$30.00 97,is072113-1 © 2010 American InstituteDownloaded of Physics to IP: This article is copyrighted as indicated in the article. Reuse of AIP content subject to the terms at: http://scitation.aip.org/termsconditions. 209.147.144.10 On: Fri, 06 Feb 2015 17:16:20 072113-2 Appl. Phys. Lett. 97, 072113 共2010兲 Scott et al. ␮ii共n,K兲 = 24␲3␧20ប3 n Z2e3mⴱ2 Nii 1 ln关1 + y共n兲兴 − y共n兲 1 + y共n兲 146.9 = 1/3 ln共1 + 6.46n20 兲− 1 1/3 6.46n20 1/3 + 6.46n20 冉 冊 1 − K cm2 . 1+K V s 共3兲 Here, dnm is the layer thickness in units of nm, n20 is the carrier concentration in units of 1020 cm−3, and C is an empirical constant which depends on the details of surface and interface scattering. For the samples discussed in Ref. 5, a value of C = 4 best fits the data, while for the three points presented in Fig. 1, C = 2.5 gives a good fit. The other fitting FIG. 1. 共Color online兲 Plots of sheet carrier concentration as a function of layer thickness for samples grown on Al2O3. Inset: mobility as a function of parameter is K = 0.47, and since K = NA / ND and n = ND − NA, thickness. The squares are measured data and the solid line is a fit to these we get finally, ND = 2.3⫻ 1021 cm−3 and NA = 1.1 21 −3 data, with n = 1.2⫻ 10 cm and K = 0.47. The dashed line is the hypotheti⫻ 1021 cm−3. These numbers must be considered tentative cal mobility for n = 1.2⫻ 1021 cm−3 and K = 0, or equivalently, NA Ⰶ ND. but clearly the layer has a very high donor concentration, composed mostly of Ga. Unfortunately, the layer also has a Thicknesses of Ga-doped ZnO/ SiO2 / Si films deposited high acceptor concentration, and a key goal of TCO develin oxygen are routinely measured using SE with a wellopment is to get rid of the acceptors. Note that if n were the established model for the layer stack. However, as the optical same but NA Ⰶ ND 共i.e., K ⬃ 0兲, then ␮ versus d would folconstants of Ga-doped ZnO films deposited in Ar have not low the dashed line in the inset of Fig. 1, and the resistivity been fully characterized, the films were deposited on Al2O3 for thick samples would drop by about a factor three at room to assure correct thicknesses for ␳ and n calculations. An temperature. For very thin samples, of course, surface/ abrupt step was obtained for profilometer 共Tencor P-10兲 meainterface scattering, and ultimately quantum effects, will alsurements by partially masking the Ga-doped ZnO film, then ways limit the mobility. immersing the wafer into an acid solution known to have a Unalloyed Ohmic contacts were fabricated using e-beam high selectivity for ZnO/sapphire, 共1:1000 HCL:deionized evaporated Ti/Pt/Au:20/30/350nm at room temperature. Exwater兲. In Fig. 1, sheet carrier concentration ns versus thickcellent specific contact resistance values of 2 – 4 ness d is plotted with error bars indicated for the two thickest ⫻ 10−8 ⍀ cm2 were measured using the transmission line samples. The data were taken at room temperature but there method 共TLM兲. Temperature stress tests were applied to is very little change in n from 15–320 K. Within error, the samples in air at temperatures up to 350 ° C by keeping points fall on a straight line, and the slope of this line is just samples at each temperature step for 1 h. No significant the volume carrier concentration n = 1.2⫻ 1021 cm−3. 共More change in contact resistivity was observed in this temperapoints will be needed to determine if there is a slight nonlinture range. At higher temperatures, alloyed contacts were earity in the data.兲 The y-axis intercept, −2 ⫻ 1015 cm−2, can formed and the contact resistance dropped sharply. The bulk perhaps be interpreted as a depletion charge due to acceptors resistivity also was not strongly affected by the stress tests, in the ZnO/ Al2O3 interface region; however, again more increasing from 5 ⫻ 10−4 to 7 ⫻ 10−4 ⍀ cm, indicating that points will be necessary to provide a definite conclusion in both the conductivity of the films and the unalloyed Ohmic this matter. contacts are stable with temperature. The room-temperature mobilities of the three points are For transparent electrode applications, the most imporplotted as a function of thickness in the inset of Fig. 1. For tant parameters are the sheet resistance ␳s and the optical samples such as these, the low-temperature mobilities are transmittance OT. For the 277 nm sample in Fig. 1, ␳s only slightly higher than those at room temperature. This is = 7.1 ⍀ / sq, a very impressive value. Unfortunately, the because most of the scattering is due to the ionized donors backsides of our Al2O3 wafers were not polished, so it was and acceptors, rather than phonons, even at room temperanecessary to measure OT on other layers, grown on polished ture. To fit the mobility data we apply a recently developed quartz. In Fig. 2, the wavelength dependence of the transmitmodel that includes degenerate Brooks–Herring theory along tance, measured with a Varian Cary 5000 spectrophotometer, with an empirical formula for boundary scattering, as is shown for Ar and O2 layers grown on quartz under condifollows:5 tions nearly identical to those pertaining to the samples of Fig. 1. We note that the OT for as-deposited O2 layers 共not shown兲 is nearly 90% from the band edge all the way to −1 −1 −1 ␮共d,n,K,C兲 = 关␮ii共n,K兲 + ␮bdry共d,n,C兲 兴 , 共1兲 2500 nm but unfortunately the conductivity of such layers is too low for TCO applications. For the highly conductive laywhere ers, i.e., the O2 layers annealed in FG, and the as-grown Ar layers, the transmission above 1000 nm decreases due to 10.58 dnm cm2 e d/C free-carrier absorption, as expected. The decrease in this re␮bdry共d,n,C兲 = = , 共2兲 1/3 gion is higher for the Ar layer because its carrier concentraVs ប 共3␲2n兲1/3 C n20 tion is higher; however, in the visible region, the Ar layer has and is copyrighted as indicated in the article. Reuse of AIP content is subject a slightly better transmittance. This article to the terms at: http://scitation.aip.org/termsconditions. Downloaded to IP: 冉 冊 209.147.144.10 On: Fri, 06 Feb 2015 17:16:20 072113-3 Appl. Phys. Lett. 97, 072113 共2010兲 Scott et al. This work was carried out at the Air Force Research Laboratory, Wright-Patterson AFB, Dayton, OH. We wish to thank T. A. Cooper for the Hall-effect measurements. The work of R.C.S. and Y.H.Z. was partially supported by Science Foundation Arizona, Contract Nos. SRG 0190-07 and SRG 0339-08, and by the Air Force Research Laboratory/ Space Vehicles Directorate, Contract No. FA9453-08-20228. The work of D.C.L. was partially supported by AFOSR under Grant No. FA9550-10-1-0079 共K. Reinhardt兲 and NSF under Grant No. DMR0803276 共L. Hess兲. 1 FIG. 2. 共Color online兲 Optical transmittance as a function of wavelength for Ga-doped ZnO deposited at 200 ° C and 10 mTorr in Ar 共solid line兲 and O2 共dashed line兲. In conclusion, highly conductive Ga-doped ZnO with excellent optical transparency has been achieved at low deposition temperatures using PLD in a pure Ar environment without the need for postdeposition anneals. The significant increase in conductivity is attributed mainly to improved Ga incorporation on donor sites, although a detailed model of growth dynamics has yet to be worked out. Sheet resistance versus thickness data suggest that the bulk carrier uniformity in thick films grown in Ar is much better than that for thick films grown in O2 and then annealed in FG. B. Du Ahn, S. H. Oh, C. H. Lee, G. H. Kim, H. J. Kim, and S. Y. Lee, J. Cryst. Growth 309, 128 共2007兲. 2 K. Yim, H. W. Kim, and C. Lee, Mater. Sci. Technol. 23, 108 共2007兲. 3 E. Millon, J. Perriere, S. 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